Description
The SEPA HY60N-05A-P801 is a precision-engineered centrifugal blower designed for high-density thermal management applications. Utilizing SEPA’s proprietary Hypro bearing technology, this unit offers a superior balance between operational longevity and acoustic performance compared to standard sleeve bearings. The 5VDC motor architecture is optimized for low power consumption while maintaining consistent static pressure delivery, essential for overcoming high thermal impedance in restricted enclosures. Its aerodynamic volute design ensures efficient airflow directionality, minimizing turbulence and maximizing heat dissipation efficiency within compact electronic assemblies. The robust housing provides structural rigidity, ensuring reliability under continuous operation.
Model Number: HY60N-05A-P801
Brand: SEPA (Nippon Keiki Works)
Product Type: Centrifugal Blower Fan
Rated Voltage: 5V DC
Voltage Range: 4.5 – 5.5 VDC
Rated Current: 0.28 A
Power Consumption: 1.40 W
Rated Speed: 5200 RPM (±10%)
Bearing Type: Hypro Bearing (Hydro-Dynamic)
Max. Air Flow: 4.2 CFM (7.13 m³/h / 0.11 m³/min)
Max. Static Pressure: 11.5 mmH₂O (112.7 Pa / 0.45 inH₂O)
Dimensions: 60mm x 60mm x 10mm (Approximate Blower Profile)
Weight: 24 g
Life Expectancy: 40,000 Hours at 40°C
Noise Level: 32.0 dB(A)
Speed Control: Tachometer Output (3-Wire)
Housing Material: PBT (UL94V-0)
Impeller Material: PBT (UL94V-0)
Operating Temperature: -10°C to +60°C
Storage Temperature: -30°C to +70°C
Termination: 3-Wire Lead with Connector
Insulation Resistance: 10MΩ at 500VDC
Dielectric Strength: 500VAC for 1 Minute
Protection: Impedance Protected, Reverse Polarity Protection
Mounting Orientation: Any
Application Category: Laptop Cooling, Spot Cooling
Designed primarily for integrated electronics cooling, the HY60N-05A-P801 excels in restricted spaces such as laptop chassis and ultra-mobile PC (UMPC) architectures. The HY60N-05A-P801 is frequently utilized in portable projector cooling, compact server blades, and industrial instrumentation where directed airflow is required to evacuate heat from heatsinks with high fin density. Its profile allows for seamless integration into consumer electronics and medical handheld devices requiring reliable thermal regulation.
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Additional information
| Shipping Weight | 1 kg |
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